AMD Ryzen Embedded V1500B
VS
Intel Xeon W-3275
AMD Ryzen Embedded V1500B
VS
Intel Xeon W-3275

Which to select

It is time to pick the winner. What is the difference between AMD Ryzen Embedded V1500B vs Intel Xeon W-3275? What CPU is more powerful? It is quite easy to determine – look at comparison table. The processor with more cores/ threads and also with higher frequency is the absolute winner!

CPU Cores and Base Frequency

Who will win between AMD Ryzen Embedded V1500B vs  Intel Xeon W-3275. The general performance of a CPU can easily be determined based on the number of its cores and the thread count, as well as the base frequency and Turbo frequency. The more GHz and cores a CPU has, the better. Please note that high technical specs require using a powerful cooling system.

2.20 GHz
Frequency
2.50 GHz
4
CPU Cores
28
No turbo
Turbo (1 Core)
4.60 GHz
Yes
Hyperthreading
Yes
No
Overclocking
No
2.20 GHz
Turbo (4 Cores)
no data
normal
Core architecture
normal
0x
A core
0x
0x
B core
0x
no data
Turbo (28 Cores)
3.40 GHz

CPU generation and family

Internal Graphics

Some manufacturers complement their CPUs with graphic chips, such a solution being especially popular in laptops. The higher the clock frequency of a GPU is and the bigger its memory, the better. Find a winner - AMD Ryzen Embedded V1500B vs Intel Xeon W-3275. 

No turbo
GPU (Turbo)
No turbo
--
Max. Memory
--

Hardware codec support

Here we deal with specs that are used by some CPU manufacturers. These numbers are mainly technical and can be neglected for the purpose of the comparison analysis.

No
h264
No
No
JPEG
No
No
VP8
No
No
VP9
No
No
VC-1
No
No
AVC
No
No
h265 / HEVC (8 bit)
No
No
h265 / HEVC (10 bit)
No
No
AV1
No

Memory & PCIe

These are memory standards supported by CPUs. The higher such standards, the better a CPU’s performance is.

DDR4-2400
Memory type
DDR4-2933
32 GB
Max. Memory
1024 GB
2
Memory channels
6
Yes
ECC
Yes
3.0
PCIe version
3.0
16
PCIe lanes
64

Encryption

Data encryption support

Yes
AES-NI
Yes

Memory & AMP; PCIe

Thermal Management

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload.

105 °C
Tjunction max.
--
25 W
TDP up
--
12 W
TDP down
--
15 W
TDP (PL1)
205 W
--
TDP (PL2)
--

Technical details

8
CPU Threads
56
4.00 MB
L3-Cache
38.50 MB
14 nm
Technology
14 nm
Great Horned Owl (Zen)
Architecture
Cascade Lake SP
AMD-V, SEV
Virtualization
VT-x, VT-x EPT, VT-d, vPro
FP5
Socket
LGA 3647
Q1/2018
Release date
Q2/2019
Market price
ca. 4250 $
x86-64 (64 bit)
Instruction set (ISA)
x86-64 (64 bit)
--
L2-Cache
--

Devices using this processor

You probably know already what devices use CPUs. These can be a desktop or a laptop.

Unknown
Used in
Unknown

Compatibility

Technologies and extensions

Virtualization technologies

Memory specs

Peripherals

Cinebench R20 (Multi-Core)

It is the new version of the benchmark which is developed on the basis of Cinebench R15 (both versions are operated on the basis of Cinema 4 - the most popular 3D modeling software). Cinebench R20 is used for multi-core processor performance benchmark tests and hyperthreading ability.

Estimated results for PassMark CPU Mark

It tests entire and overall performance of the central processing unit (mathematical calculations, compression and decompression speed, 2D&3D graphic tests). Please note that data can differ from the real-world situations.